[Photo by Wang Yang]
On April 26, the Overseas Huasheng High-end Micro/Nano-scale Electronic Materials Industrialization Project (Phase I) officially began operations in Jinpu New Area.
The facility will become the largest electronic paste research and development (R&D) and production base in China, leveraging advanced core technologies for high-precision nano-scale metal electronic paste preparation. The project aims to mitigate the domestic supply shortage of electrode materials and drive the structural upgrade of China's electronics industry.
Dalian Overseas Huasheng Electronics Technology Co Ltd is a national high-tech enterprise specializing in the development and production of high-end electronic component electrode materials. Recognized as a "little giant" enterprise, it sets the industry standard for inner electrode pastes of chip ceramic capacitors and leads in China's electronic paste sector.
The Phase I project, covering 17,000 square meters with an investment of 300 million yuan ($41.45 million), will establish an internationally leading R&D and production base for microelectronic devices, substrate electrode materials, and advanced semiconductor packaging pastes.
This initiative is expected to foster the development of a high-end electrical materials industry chain ecosystem for electronic components. The facility is designed to have an annual production capacity of 600 tons, with projected annual revenue of 1.5 billion yuan and tax contributions of 150 million yuan once fully operational.
Plans for the project's second phase are currently underway, with design work starting later this year, construction beginning early next year, and operations expected to commence by the end of next year.
