R&D and manufacturing of key components of semiconductor equipment developed by U-precision has been completed in less than three years. 

Its high-end equipment in the integrated circuit field such as lithography machine workbenches and precision motion tables has achieved large-scale production.

"Our new project can't be quickly put into production without the support of the Beijing Economic and Technological Development Area (BDA)," said Sun Guohua, general manager of U-precision Technology Co., Ltd.

Founded in 2012, U-precision focuses on the R&D and industrialization of integrated circuit equipment technology. 

It is in a leading position in the R&D and industrialization of an important component of the front-end lithography machine, namely, the dual work stage. 

The company is the second in the world that can produce dual-stage lithography machines; the other is ASML in the Netherlands.

U-precision launched its project on key components semiconductor equipment in the BDA in May 2018.

The BDA listed it into its "seven-promotion" scheme to provide butler-style services throughout the entire process of project construction.

With a total construction area of over 45,500 square meters, U-precision’s R&D and manufacturing project of key components was put into use after that. 

The "seven-promotion" working mechanism implemented by the BDA provides enterprises with active and full-cycle services, from contract signing, delisting, commencement, completion and production to reaching target output.

Thirty-four projects were promoted to the next stage through the "seven promotion" working mechanism in the first quarter of this year, according to statistics from BDA's Business Cooperation Bureau. 

Among them, there are 24 newly contracted projects, including Xinchuang Park series projects, with a total project investment of 67.2 billion yuan ($10.36 billion).

Three projects have been delisted, four projects have been started, one project has been completed and two have entered production.

For instance, the first phase of the 12-inch integrated circuit wafers and integrated circuit packaging project of SMIC Beijing received comprehensive government services from its launch to completion. 

The project took nine days to acquire land and start construction, instead of at least 90 days in the past.