The Beijing Municipal Science and Technology Commission and the Zhongguancun Administrative Committee released the 2023 declaration list for the technological research and development project of automotive grade chips on Mar 27. 

The list aims to select various innovative entities nationwide to carry out technological research and development. It includes 11 types of chips of different values to be developed in the three categories of analog, MCU, and power; the total value of the work is to reach 42 million yuan ($6.1 million).

The highest-valued item on the list is the new-generation vehicle dual-core heterogeneous central gateway control MCU chip, with a list amount of up to 6.5 million yuan. The listed values for other projects range from 2 million yuan to 6 million yuan.

Based on the 2022 list, this year's list focuses more on urgently needed and pressing automotive grade chips for complete-vehicle enterprises, and describes the tasks in four aspects: functional performance, packaging form, deliverables, and project cycle, making the research and development tasks clearer and more operable.

Meanwhile, the list is open nationwide, and entities outside Beijing are encouraged to apply in hopes they will settle in Beijing. 

The 2023 declaration list for the technological research and development project of automotive grade chips aims to select various innovative entities nationwide to carry out technological research and development. [Photo/IC]

Relevant districts will provide high-quality business environments and guarantees for the settled enterprises. Enterprises are also advised to form innovation alliances with universities and research institutes.

Based on project technical maturity, mass production capability, team comprehensive ability, and achievement indicators, the team with the best performance will be selected.

Through the declaration list, Beijing hopes to help complete-vehicle enterprises to solve part of the chip demand, accelerate the layout of chip enterprises in automotive grade products, and enter the complete-vehicle supply chain.

In the next step, the Beijing Municipal Science and Technology Commission and the Zhongguancun Administrative Committee will continue to grasp the important window period for the development of automotive grade chips, adhere to the guidance of the needs of complete-vehicle applications, accelerate the improvement of the automotive grade chip industrial ecosystem, incubate and cultivate a group of high-growth, core-competitive automotive grade chip enterprises, and promote the development of the intelligent connected vehicle industry and the integrated circuit industry.