Silicon Box cutting-edge, advanced panel-level packaging foundry announces $3.6B investment for expansion into Italy

Silicon Box cutting-edge, advanced panel-level packaging foundry announced its intention to collaborate with the Italian government to invest up to $3.6B (€3.2B) in Northern Italy, as the site of a new, state-of-the-art semiconductor assembly and test facility. This facility will help meet critical demand for advanced packaging capacity to enable next generation technologies that Silicon Box anticipates by 2028. The multi-year investment will replicate Silicon Box's flagship foundry in Singapore which has proven capability and capacity for the world's most advanced semiconductor packaging solutions, then expand further into 3D integration and testing. When completed, the new facility will support approximately 1,600 Silicon Box employees in Italy. The construction of the facility is also expected to create several thousand more jobs, including eventual hiring by suppliers. Design and planning for the facility will begin immediately, with construction to commence pending European Commission approval of planned financial support by the Italian State.

As well as bringing the most advanced chiplet integration, packaging, and testing to Italy, Silicon Box's manufacturing process is based on panel-level-production; a world leading, first-of-its-kind combination that is already shipping product to customers from its Singapore foundry. Through the investment, Silicon Box has plans for greater innovation and expansion in Europe, and globally.  The new integrated production facility is expected to serve as a catalyst for broader ecosystem investments and innovation in Italy, as well as the rest of the European Union.

"We believe innovation is driven by cultural values that embrace curiosity, passion, and a tireless commitment to excellence," said Dr. Byung Joon (BJ) Han, co-founder and CEO of Silicon Box. "Italy was one of our top choices for global expansion because we found that its culture shares our values. We have seen great promise through our collaborations with the Italian government and various regional, institutional and commercial stakeholders to date, which we know will be necessary to successfully execute this first-of-a-kind project in Europe."

"We are excited to bring Italy to the forefront of chiplet deployment and the semiconductor industry, through this investment into the world's most advanced packaging solution. It will enhance competitive strengths in design, artificial intelligence (AI), large language models (LLMs), electronic vehicles (EVs) and automotive, mobile, wearables, smart consumer, edge computing, and material sciences of the Italian ecosystem, and revolutionize Europe's position in the global [semiconductors] supply chain," said Dr. Sehat Sutardja, co-founder and Chairman of Silicon Box. "Throughout my career, I have always been a big believer in Italian and European ingenuity."