The DF30 chip developed by Dongfeng Motor. [Photo/WeChat account: whkfq]
Wuhan Economic & Technological Development Zone (WEDZ) is making notable progress in the semiconductor sector, highlighted by recent breakthroughs in high-end photolithography materials and advanced chip technology.
Hubei Dinglong Co has announced the commencement of its high-end photolithography project, boasting an annual capacity of 300 metric tons, alongside the launch of Hubei Xintao's advanced electrostatic chuck project.
This development marks a significant leap forward in technology and supply chain management, achieving complete autonomy from raw materials to finished products.
Dinglong's CMP polishing pads now hold nearly 80 percent of the domestic market, breaking the long-standing dominance of overseas giants. The company is broadening its product range to include CMP pads, display materials, photolithography materials, and electrostatic chucks.
WEDZ is cultivating a collaborative ecosystem in automotive-grade chip design. SiEngine Technology Co has introduced China's first automotive-grade 7nm smart cockpit chip, which has already exceeded 1 million units shipped and is utilized by major automakers such as Lynk & Co, Hongqi, and Volkswagen.
Dongfeng Motor Corporation has also developed the DF30, a high-end automotive-grade MCU chip.
WEDZ's integrated approach — from photolithography to chip design — demonstrates a transition from isolated breakthroughs to comprehensive system solutions, ensuring supply chain security and fostering a robust industrial ecosystem.
