Qingpu district and Fudan University launch innovation centers

The inauguration ceremony for two innovation centers between Qingpu district and Fudan University is held on June 21. [Photo/shqp.gov.cn]

On June 21, Shanghai's Qingpu district and Fudan University celebrated a major milestone in technological innovation by opening the National Science Park of Fudan University (Qingpu Innovation Center) and the Fudan University (Hongqiao) Global Alumni Sci-Tech Innovation Center. This event signifies a new chapter in their strategic collaboration, emphasizing the development of advanced technology.

The Qingpu Innovation Center strives to be a leading hub for converting scientific and technological innovations into practical applications. Its mission involves resource integration, achievement transformation, startup incubation, talent cultivation, and promoting collaborative growth, thereby establishing a standard for university and local government cooperation.

The Hongqiao Global Alumni Sci-Tech Innovation Center utilizes the extensive Fudan alumni network worldwide, regarded as a key strategic resource. It serves as a bridge to foster stronger connections between the university, its alumni, and regional development initiatives.

The center includes areas for roadshows, small and medium meetings, sci-tech displays, and incubation, addressing various needs such as guest reception, alumni networking, and startup team activities.

Fudan University President Jin Xiaoming highlighted that these centers deepen the cooperation between Fudan and Qingpu. They will focus on integrating education, technology, and talent, promoting collaboration among universities, government, and businesses.

During the event, Qingpu district and Fudan University unveiled the "Concept Verification Special Policy". This initiative encourages groundbreaking research in areas like AI and biotechnology, aiming to foster revolutionary progress. Qingpu has also established a dedicated fund for the next five years to support the industry application of Fudan University's research in fields such as "AI + Biotechnology".

Several companies signed agreements to establish themselves at the Qingpu Innovation Center, focusing on fields such as medical big data, diabetes health management, AI earphones, and endoscopic surgical robots.

To assist hard-tech companies with financing difficulties, the Bank of Shanghai has signed a 1-billion-yuan ($139.28 million) credit agreement with the Qingpu Innovation Center. The bank will offer financial products like "investment-loan linkage" and "talent loans" specifically designed for sci-tech innovation enterprises.

Furthermore, the "Bank of Shanghai Cup AI Innovation and Entrepreneurship Competition" was introduced, inviting innovative AI projects globally. The contest provides substantial prizes along with industrial resource support.