Shanghai Launchip Technology Co Ltd, a developer of silicon-based passive devices for advanced chip packaging, has raised nearly 200 million yuan ($27.8 million) in a Pre-A+ funding round.
Based in Tongji Economic Park in Jiading district, the company will use the proceeds to develop silicon capacitors, resistors, and inductors, expand its team, and purchase key equipment as it scales up production and delivery.
Following the funding round, Launchip plans to accelerate product development and customer adoption, strengthen cooperation with supply-chain partners, establish an overseas research and development center, and recruit international talent.
As AI models and high-performance computing drive higher chip performance and power consumption, power delivery has become increasingly challenging. Silicon capacitors help stabilize power supplies in compact packages for high-performance chips such as GPUs and CPUs.
Launchip has developed surface-mount silicon capacitors for use outside chip packages and multi-terminal capacitors embedded in package substrates. The company holds 34 core patents and chip layout design registrations.
The company said its embedded products are already being delivered at scale for CPUs and GPUs, with orders worth hundreds of millions of yuan. It also supplies an overseas customer with optical modules.
The company said more than 20 customers are in mass production or product validation, and its monthly capacity exceeds 500 million units. Launchip offers more than 200 mass-produced models across its silicon capacitor and resistor lines and is developing silicon inductors and solutions for 2.5D and 3D integration.