The 3D TSV project, based on the strategic cooperation agreement signed between China Aerospace Science and Technology and the Zhuhai Municipal People's Government in September 2022, broke the ground on March 30 in the Zhuhai National Hi-Tech Industrial Development Zone (Tangjiawan).

Groundbreaking ceremony [Photo by Wu Changfu / Guanhai App]

The project will be built into an industrial leading sci-tech research and production base for 3D TSV. It is jointly invested in by the Xi'an Microelectronics Technology Institute, China Times Prospect Science & Technology, ZTC Holdings, Shenzhen Capital Group, and Zhuhai Gejin No 6 Equity Investments.

The project was introduced to Zhuhai via the China International Aviation and Aerospace Exhibition, a major platform for global exchanges and cooperation also known as Airshow China. The exhibition gathers enterprise resources in fields of aerospace, high-end manufacturing, national defense industry, military-civil dual-purpose technologies, and electronic information.